Hidekazu Manabe
5Patents
2h-index
12Co-inventors
40Inventor score
Filing activity: Oct 29, 1996 → Oct 9, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6925922B2 | Apparatus for removing tiebars after molding of semiconductor chip | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6363976B1 | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device | Electricity | 2 | Expired |
| US5950687A | Lead forming apparatus and lead forming method | Electricity | 1 | Expired |
| US7185425B2 | Method for connecting printed circuit boards | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7077170B2 | Method of forming leads of a semiconductor device | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.