Lead forming apparatus and lead forming method
US5950687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1996 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Oct 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.