Inventor · Amagasaki, JP

Hideki Hidaka

10Patents
2h-index
8Co-inventors
47Inventor score

Filing activity: Oct 2, 1990 → Jun 2, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US5060841A wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus Electricity 27 Expired
US8091236B2 Manufacturing method for toothed power transmission member having oil reservoir and toothed power transmission member manufactured by this manufacturing method Emerging Cross-Sectional Technologies 2 Active
US10236793B2 Grid connection power conversion device and output current control method thereof Emerging Cross-Sectional Technologies 2 Active
US10218261B2 Grid connection power conversion device and start-up control method therefor Emerging Cross-Sectional Technologies 1 Active
US9970988B2 Relay abnormality detection device and power conditioner Emerging Cross-Sectional Technologies 1 Active
US9943248B2 Electronic device, control method, and control program Electricity 1 Active
US9977094B2 Islanding operation detection and islanding operation detection method Emerging Cross-Sectional Technologies 0 Active
US10411478B2 Grid connection power conversion device and disconnection/welding detection method therefor Emerging Cross-Sectional Technologies 0 Active
US10418812B2 Abnormality detection device for grid interconnection relay and power conditioner Emerging Cross-Sectional Technologies 0 Active
US10536000B2 Grid independent operation control unit, power conditioner, and grid independent operation control method Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.