wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5060841A · kind A · utility
27Cited by
5References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 2, 1990 |
| Grant date | Oct 29, 1991 |
| Priority date | — |
| Expiry date | Oct 2, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.