Hin Kooi Chee
2Patents
2h-index
7Co-inventors
30Inventor score
Filing activity: Jul 25, 1997 → Jan 4, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5973388A | Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe | Electricity | 174 | Expired |
| US5920113A | Leadframe structure having moveable sub-frame | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.