Leadframe structure having moveable sub-frame

US5920113A · kind A · utility

Assignee

• Motorola, Inc. · US

Inventors

• Hin Kooi Chee · Seremban, MY
• Chee Hiong CHEW · Seremban, MY
• Hou Boon Tan · Seremban, MY
• Robert J. McLaughlin · Allentown, US
• David M. Culbertson · Tempe, US
• Alex Elliott · Bedford, US
• Keng Guan Quah · Gilbert, US

Key dates

• Filing date: Jul 25, 1997
• Grant date: Jul 6, 1999
• Expiry date: Jul 25, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A leadframe (1) includes a main frame having longitudinal outer rails (4) and a number of sub-frame (8) separated from the main frame by a slit (6) extending around at least part of the perimeter of the sub-frame (8). A plurality of flag portions (2), on which a semiconductor die is to be mounted, extend from the mainframe and a plurality of lead portions (12) extend from the sub-frame (8) towards the flag portions (2). The sub-frame (8) is bent twice in a zig-zag fashion so as to be in a plane parallel to that of the main frame so that the corresponding flag and lead portions overlap without affecting the dimensions of the outer edge portion of the main frame.