Hiroshi Uragami
3Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Nov 20, 2003 → Jun 30, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7056770B2 | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material | Electricity | 9 | Expired |
| US9728426B2 | Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member | Electricity | 1 | Active |
| US9580827B2 | Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.