Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
US9728426B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2014 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Dec 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.