Ho-eun Bae
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Mar 18, 2013 → Mar 18, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9034750B2 | Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.