Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same
US9034750B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Mar 18, 2013 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Aug 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/1152
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.