Hoe Min CHEONG
1Patents
0h-index
1Co-inventors
16Inventor score
Filing activity: Apr 14, 2015 → Apr 14, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10134681B2 | Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.