Inventor · Regenstauf, DE

Holger Klassen

4Patents
1h-index
9Co-inventors
30Inventor score

Filing activity: Apr 10, 2018 → Jun 3, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US11450794B2 Carrier and component with a buffer layer, and method for producing a component Electricity 1 Active
US11521946B2 Method for temporarily fastening a semiconductor chip to a surface, method for producing a semiconductor component and semiconductor component Electricity 0 Active
US11094868B2 Method for producing an illumination device and illumination device Electricity 0 Active
US11437550B2 Optoelectronic component and method of producing an optoelectronic component Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.