Carrier and component with a buffer layer, and method for producing a component

US11450794B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Paola Altieri-Weimar · Regensburg, DE
• Ingo Neudecker · Regensburg, DE
• Michael Zitzlsperger · Regensburg, DE
• Stefan Groetsch · Bad Abbach, DE
• Holger Klassen · Regenstauf, DE

Key dates

• Filing date: Jul 23, 2018
• Grant date: Sep 20, 2022
• Expiry date: Nov 25, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364

Abstract

A carrier and a component are disclosed. In an embodiment a component includes a semiconductor chip including a substrate and a semiconductor body arranged thereon and a metallic carrier having a coefficient of thermal expansion which is at least 1.5 times greater than a coefficient of thermal expansion of the substrate or of the semiconductor chip, wherein the semiconductor chip is attached to a mounting surface of the metallic carrier by a connection layer such that the connection layer is located between the semiconductor chip and a buffer layer and adjoins a rear side of the semiconductor chip, wherein the buffer layer has a yield stress which is at least 10 MPa and at most 300 MPa, and wherein the substrate of the semiconductor chip and the metallic carrier of the component have a higher yield stress than the buffer layer.