Honghui Mou
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Dec 28, 2017 → Dec 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10410854B2 | Method and device for reducing contamination for reliable bond pads | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.