Method and device for reducing contamination for reliable bond pads
US10410854B2 · kind B2 · utility
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1References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 28, 2017 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Dec 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05624
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure generally relates to methods for cleaning the backside of a wafer. A wet cleaning method may be used by stripping off the uppermost spacer layers on the backside of the wafer using a cleaning solution. In one embodiment, hydrogen fluoride (HF) solution may be employed to remove the nitride/oxide spacer layer. In another embodiment, a dry cleaning method may be employed to etch the wafer at the bevel region. Residues are completely removed from the wafer backside. This method improves the yield and storage life of the semiconductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.