Hongjun Yao
5Patents
3h-index
8Co-inventors
46Inventor score
Filing activity: Jun 11, 2003 → Jul 17, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7070419B2 | Land grid array connector including heterogeneous contact elements | Electricity | 61 | Expired |
| US6916181B2 | Remountable connector for land grid array packages | Electricity | 40 | Expired |
| US6869290B2 | Circuitized connector for land grid array | Electricity | 28 | Expired |
| US9024315B2 | Daisy chain connection for testing continuity in a semiconductor die | Electricity | 3 | Active |
| US11482844B2 | Monitoring system of cable laying state | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.