Daisy chain connection for testing continuity in a semiconductor die

US9024315B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Hongjun Yao · Sunnyvale, US
• Michael Laisne · Encinitas, US
• Matthew Michael Nowak · San Diego, US
• Glen T. Kim · San Diego, US
• Mark C. Chan · San Diego, US
• Shiqun Gu · San Diego, US

Key dates

• Filing date: Mar 13, 2013
• Grant date: May 5, 2015
• Expiry date: Mar 17, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit product package configured to continuity testing is described. The integrated circuit product package includes a package substrate. The package substrate includes internal routing connections. The integrated circuit product package also includes a semiconductor die coupled to the package substrate. The semiconductor die includes input/output (I/O) pins and switches. The switches selectively coupled the I/O pins to facilitate a daisy chain connection. The daisy chain connection includes circuitry fabricated on the semiconductor die, more than two of the internal routing connections, more than two of the I/O pins and at least one switch.