Hsien-Chie Cheng
5Patents
2h-index
14Co-inventors
44Inventor score
Filing activity: Mar 10, 2006 → Jun 4, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8134823B2 | Stacked capacitor structure and manufacturing method thereof | Electricity | 15 | Active |
| US7211886B2 | Three-dimensional multichip stack electronic package structure | Electricity | 9 | Expired |
| US10932361B2 | Circuit board and electronic device | Electricity | 2 | Active |
| US7999350B2 | Electrode structure of memory capacitor | Electricity | 2 | Active |
| US7378746B2 | Composite bump | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.