Hsien-Chieh Lin
9Patents
3h-index
10Co-inventors
50Inventor score
Filing activity: Feb 7, 2007 → Jun 14, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7528482B2 | Embedded chip package with improved heat dissipation performance and method of making the same | Electricity | 13 | Active |
| US8420954B2 | Printed circuit board and method for fabricating the same | Emerging Cross-Sectional Technologies | 13 | Active |
| US7521800B2 | Solder pad and method of making the same | Electricity | 6 | Active |
| US7576287B2 | Lot traceable printed circuit board | Electricity | 1 | Active |
| US8378225B2 | Printed circuit board and method for fabricating the same | Electricity | 0 | Active |
| US10236395B2 | Antireflection substrate structure and manufacturing method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US8243464B2 | Printed circuit board structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US10798828B2 | Circuit board structures and methods of fabricating the same | Electricity | 0 | Active |
| US9224893B2 | Antireflection substrate structure and manufacturing method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.