Solder pad and method of making the same
US7521800B2 · kind B2 · utility
6Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2007 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Aug 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0574
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder pad structure includes a first metal layer disposed on an insulation layer, wherein the first metal layer is electrically connected with an underlying interconnection circuit layer through a conductive through hole disposed in the insulation layer. A solder resist layer having an opening exposing a central portion of the first metal layer is disposed on the insulating layer. A pillar-shaped second metal layer is disposed within the opening directly on the first metal layer. A solder ball filled into the opening is in contact with the pillar-shaped second metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.