Hsien-Ming Tai
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Feb 26, 2018 → Feb 26, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10867851B2 | Contact structure and semiconductor device and method of forming the same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.