Hsin-Hsing Wei
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jun 11, 1999 → Jun 11, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6093960A | Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance | Electricity | 26 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.