Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance
US6093960A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1999 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Jun 11, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has a die and a plurality of leads electrically connected to the die with bonding wires. A heat spreader has an upper face thermally contacted with the die. The heat spreader is formed by a copper core having at least a portion of surface sequentially coated with a metal medium layer and an insulation layer, wherein the metal medium layer has an adhesion degree with insulation material higher than copper. A package body encapsulates the die, the heat spreader and the plurality of leads, wherein the surface area of the heat spreader that contacts with the package body is coated with the metal medium layer and the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.