Huabin Yan
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Dec 30, 2022 → Dec 30, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12254950B2 | Dies, semiconductor package structures, enable pin configuration methods and memories | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.