Hugh Li
3Patents
3h-index
6Co-inventors
39Inventor score
Filing activity: Mar 31, 1999 → Sep 25, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6358847B1 | Method for enabling conventional wire bonding to copper-based bond pad features | Electricity | 35 | Expired |
| US6610601B2 | Bond pad and wire bond | Electricity | 7 | Expired |
| US7300480B2 | High-rate barrier polishing composition | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.