Hui Fu
9Patents
5h-index
15Co-inventors
60Inventor score
Filing activity: Mar 15, 2001 → Aug 22, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6773532B2 | Method for improving heat dissipation in optical transmitter | Emerging Cross-Sectional Technologies | 37 | Expired |
| US7322754B2 | Compact optical sub-assembly | Physics | 25 | Expired |
| US6647039B2 | Reconfigurable laser header | Electricity | 16 | Expired |
| USD663694S1 | Receptacle connector | General | 9 | Active |
| US6859470B2 | Air trench that limits thermal coupling between laser and laser driver | Physics | 8 | Expired |
| US6452254B2 | Optical package with dual interconnect capability | Electricity | 4 | Expired |
| US8102721B2 | Pseudo dual-port memory | Physics | 1 | Active |
| USD1077896S1 | Photography stick | General | 1 | Active |
| US10825545B2 | Memory device loopback systems and methods | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.