Optical package with dual interconnect capability
US6452254B2 · kind B2 · utility
4Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Mar 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is adapted to be coupled in a single-ended configuration and in a differential configuration. The package provides a characteristic impedance of approximately 50 ohms when configured in a single-ended mode and also when configured in the differential mode. The package includes multiple terminals, which are coupled to ground, S, and {overscore (S)}. The package may be configured externally by the user for either mode. The package may also be fabricated to be coupled in either the differential mode or single-ended mode for user specific applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.