Huijae Kim
6Patents
1h-index
16Co-inventors
37Inventor score
Filing activity: May 19, 2020 → Nov 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11006268B1 | Determining technological capability of devices having unknown technological capability and which are associated with a telecommunication network | Electricity | 12 | Active |
| US11343381B2 | Identifying and resolving telecommunication network problems using network experience score | Electricity | 1 | Active |
| US11510050B2 | Determining technological capability of devices having unknown technological capability and which are associated with a telecommunication network | Electricity | 0 | Active |
| US12424585B2 | Apparatus for bonding chip band and method for bonding chip using the same | Electricity | 0 | Active |
| US11743393B2 | Identifying and resolving telecommunication network problems using network experience score | Electricity | 0 | Active |
| US12027401B2 | Semiconductor substrate alignment device and a semiconductor substrate bonding system using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.