Apparatus for bonding chip band and method for bonding chip using the same
US12424585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Mar 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.