Hung Chen Kuo
3Patents
0h-index
7Co-inventors
24Inventor score
Filing activity: Apr 17, 2020 → Mar 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11605598B2 | Semiconductor device package and method of manufacturing the same | Electricity | 0 | Active |
| US12068259B2 | Semiconductor device package and method of manufacturing the same | Electricity | 0 | Active |
| US12009313B2 | Semiconductor package shielding structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.