Hyun Heo
8Patents
1h-index
9Co-inventors
36Inventor score
Filing activity: Apr 27, 2011 → Dec 2, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9299447B2 | 3-dimensional semiconductor device having memory cells stacked over substrate | Physics | 7 | Active |
| US9754950B2 | Semiconductor device including transistor having offset insulating layers | Electricity | 1 | Active |
| US9467050B2 | Semiconductor apparatus having transfer circuit transferring high voltage | Physics | 0 | Active |
| US10559576B2 | Manufacturing method of semiconductor device including transistor having offset insulating layers | Electricity | 0 | Active |
| US8537632B2 | Method of erasing semiconductor memory device | Physics | 0 | Active |
| US9030901B2 | Semiconductor memory device | Physics | 0 | Active |
| US9053763B2 | Non-volatile memory devices and methods of manufacturing the same | Physics | 0 | Active |
| US11342350B2 | Semiconductor memory device with improved operation speed | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.