Ilya Hecht
2Patents
2h-index
12Co-inventors
31Inventor score
Filing activity: Jan 19, 2007 → Apr 25, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7807508B2 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Electricity | 55 | Active |
| US7936062B2 | Wafer level chip packaging | Electricity | 54 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.