Inane Meric
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Dec 28, 2016 → Dec 28, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11652067B2 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.