Isaac Rivera
3Patents
1h-index
3Co-inventors
27Inventor score
Filing activity: Jan 17, 2023 → Jun 12, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11756848B1 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Electricity | 1 | Active |
| US12125759B2 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Electricity | 0 | Active |
| US12261091B2 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.