Jaehak Kim
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Sep 6, 2006 → Sep 6, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7459388B2 | Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.