JaeHak Yee
5Patents
3h-index
13Co-inventors
46Inventor score
Filing activity: May 17, 2010 → Feb 1, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9105647B2 | Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material | Electricity | 5 | Active |
| US9287204B2 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | Electricity | 4 | Active |
| US9240331B2 | Semiconductor device and method of making bumpless flipchip interconnect structures | Electricity | 4 | Active |
| US9245770B2 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | Electricity | 3 | Active |
| US9721921B2 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.