Jaewha Park
4Patents
1h-index
9Co-inventors
33Inventor score
Filing activity: Jul 5, 2018 → Jun 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10566284B2 | Semiconductor device | Electricity | 1 | Active |
| US11764145B2 | Wiring structure having double capping structure, manufacturing method thereof, and integrated circuit chip having the same | Electricity | 0 | Active |
| US11700722B2 | Method for manufacturing a semiconductor device using a support layer to form a gate structure | Electricity | 0 | Active |
| US12101923B2 | Semiconductor device including gate structure having first portion and second portion and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.