Jaime Saravia
4Patents
3h-index
12Co-inventors
37Inventor score
Filing activity: Mar 24, 1997 → Oct 20, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5897375A | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture | Chemistry; Metallurgy | 190 | Expired |
| US6045435A | Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects | Electricity | 22 | Expired |
| US6204169A | Processing for polishing dissimilar conductive layers in a semiconductor device | Electricity | 18 | Expired |
| US5985755A | Processing for polishing dissimilar conductive layers in a semiconductor device | General | 3 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.