James A. Rew
7Patents
5h-index
10Co-inventors
56Inventor score
Filing activity: Nov 10, 1976 → Aug 9, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4801069A | Method and apparatus for solder deposition | Electricity | 24 | Expired |
| US4840305A | Method for vapor phase soldering | Electricity | 19 | Expired |
| US5293983A | Transport/stacker module for mail processing system | Emerging Cross-Sectional Technologies | 17 | Expired |
| US4909429A | Method and apparatus for solder deposition | Emerging Cross-Sectional Technologies | 16 | Expired |
| US4802276A | Apparatus for printed wiring board component assembly | Emerging Cross-Sectional Technologies | 10 | Expired |
| US4069999A | Spring type dogging device | Performing Operations; Transporting | 4 | Expired |
| US4135298A | Deformable heat transfer fin | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.