Apparatus for printed wiring board component assembly
US4802276A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1987 |
| Grant date | Feb 7, 1989 |
| Priority date | — |
| Expiry date | Mar 30, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53252
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for printed wiring board assembly provides for the populating with components of a printed wiring board having at least one adjacent pair of pad rows onto which solder has been deposited. A curable adhesive strip is applied between the adjacent pair of pad rows. The adhesive strip has a first adhesive side which adheres to the printed wiring board and an opposed, second adhesive side onto which the components are selectively mounted so that the component's leads are aligned with the pad rows. A predetermined constant force is applied to the components and the adhesive strip is cured. The apparatus supports the printed wiring board and maintains a predetermined constant force on the components. A frame defining a generally U-shaped member has an upper and a lower surface. The U-shaped member has a slot therein for receiving the printed wiring board therein. An upper and a lower cover member are removably secured to the U-shaped member to generally enclose the printed wiring board. Resilient biasing is disposed between the printed wiring board and the cover members, whereby a predetermined constant force is maintained on the mounted components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.