James C. Burnham
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Oct 23, 2020 → Oct 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11203816B1 | Electroplating seed layer buildup and repair | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.