Patent · US Active

Electroplating seed layer buildup and repair

US11203816B1 · kind B1 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Marvin L. Bernt · Kalispell, US
James C. Burnham · Kalispell, US
Robert Mikkola · Kalispell, US

Key dates

Filing date	Oct 23, 2020
Grant date	Dec 21, 2021
Priority date	—
Expiry date	Oct 23, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76879
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty cycle of less than or about 50%. The methods may include plating a first amount of metal on a substrate within the plating bath. The substrate may define a via within the substrate. The methods may include, subsequent the first period of time, transitioning the power supply to a continuous DC current delivery for a second period of time. The methods may include plating a second amount of metal on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.