James E. Hisert
5Patents
2h-index
9Co-inventors
40Inventor score
Filing activity: Oct 4, 2004 → Aug 20, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7109873B2 | Fiber optic cable sensor for movable objects | Physics | 4 | Expired |
| US10943796B2 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 2 | Active |
| US10943795B2 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US10607857B2 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US11766721B2 | Thermally decomposing build plate for facile release of 3D printed objects | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.