Jean-Pierre Dupic
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jul 20, 1995 → Jul 20, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5506296A | Moisture-curable hot-melt adhesive compositions | Chemistry; Metallurgy | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.