Moisture-curable hot-melt adhesive compositions
US5506296A · kind A · utility
6Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1995 |
| Grant date | Apr 9, 1996 |
| Priority date | — |
| Expiry date | Jul 20, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Unique hot-melt adhesive compositions that irreversibly crosslink in a few days in the presence of atmospheric moisture comprise a polyisocyanated EVA terpolymer having a melt index at 190.degree. C. ranging from 100 to 1,000, such polyisocyanated terpolymer comprising (1) from 60% to 90% by weight of ethylene, (2) from 10% to 40% by weight of vinyl acetate and (3) from 5 to 60 meq. OH of an ethylenically unsaturated termonomer bearing at least one primary hydroxyl functional group per mole, and the composition being essentially devoid of free hydroxyl functional groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.