Jeff Ju
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Mar 12, 2008 → Mar 12, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7768108B2 | Semiconductor die package including embedded flip chip | Electricity | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.