Jen-Hau Cheng
9Patents
5h-index
14Co-inventors
56Inventor score
Filing activity: Jul 30, 2004 → Nov 11, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9651312B2 | Flexible thermal ground plane and manufacturing the same | Emerging Cross-Sectional Technologies | 15 | Active |
| US9909814B2 | Flexible thermal ground plane and manufacturing the same | Emerging Cross-Sectional Technologies | 15 | Active |
| US8426720B2 | Micro thermoelectric device and manufacturing method thereof | Electricity | 10 | Active |
| US9163883B2 | Flexible thermal ground plane and manufacturing the same | Emerging Cross-Sectional Technologies | 10 | Active |
| US10571200B2 | Thermal ground plane | Emerging Cross-Sectional Technologies | 5 | Active |
| US10527358B2 | Thermal ground plane | Emerging Cross-Sectional Technologies | 5 | Active |
| US8542489B2 | Mechanically-reattachable liquid-cooled cooling apparatus | Emerging Cross-Sectional Technologies | 3 | Active |
| US7550289B2 | Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereof | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US11353269B2 | Thermal ground plane | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.