Jerrad Martinson
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Jan 29, 2021 → Jan 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11711885B2 | Method of manufacturing printed circuit board assemblies with engineered thermal paths | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.