Method of manufacturing printed circuit board assemblies with engineered thermal paths
US11711885B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2021 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.