Jerry Deleon
3Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: Oct 1, 2009 → Jul 10, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9018074B2 | Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same | Electricity | 9 | Active |
| US8431951B2 | Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation | Electricity | 2 | Active |
| US8791492B2 | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.